Session 5: The Implications of Heat in Your High Performance DC Cabinet?
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The insatiable demand for ever-increasing computing power is transforming data centers. Emerging Generative Artificial Intelligence (GenAI) technology requires significant bandwidth, minimal latency, and high-performance processing that pushes power consumption upwards. Thermal management is a critical issue in high-density GenAI clusters, where rack power densities can exceed 25 kW.
In this deep-dive session, Ryan Harris, High-Speed Cable Assemblies Market Manager at Siemon will provide a comprehensive overview of the challenges and solutions associated with heat generation in high-performance DC cabinets.
Join this session to discover more about:
- High-performance applications driving increased power and heat in DC cabinets
- Emerging cooling methods used in high-density DC cabinet systems
- How cabling plays a role in reducing power and heat in your DC cabinets
Presenters
Ryan Harris
High-Speed Cable Assemblies Market Manager, Siemon
Ryan Harris is a High-Speed Cable Assemblies Market Specialist with Siemon, headquartered in Watertown, CT. Ryan has over 12 years’ experience as a customer facing Sales Engineer supporting network equipment OEM’s, hyperscale end-users, ODM’s and system integrators with point-to-point cabling solutions. Specializing in deployment of server system connections in both data center and telecommunication environments. Having a strong understanding of Top-of-Rack applications and a track record of staying up to speed with emerging technologies Ryan communicates technical benefits to provide best-in-class core DC and Edge solutions. With a goal to help Network Engineers understand their options to deploy systems on-time and on budget with attention to detail and a strong customer service ethic.
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