Enabling Highly Flexible Infrastructure for Today’s Smart Building
A zone cabling design consists of horizontal cables run from the telecommunications room (TR) to an intermediate connection point that is typically housed in a zone enclosure located in the ceiling space, on the wall, or below an access floor. From the zone enclosure, shorter easy-to-manage links connect directly to devices or to outlets serving voice, data or other systems.
Zone cabling enables rapid reorganization and faster, less disruptive moves, adds and changes because changes are limited to the shorter cabling link between the zone enclosure and the device instead of the entire length of horizontal cabling. This highly flexible infrastructure is ideally suited for smart buildings and the convergence of devices such as LED lights, security cameras, wireless access points or building automation controllers over one unified network.
Ideal for deployments in air handling spaces, Siemon’s plenum-rated zone cabling enclosures work in conjunction with Siemon’s plenum-rated cabling, Surface Mount Boxes, Surface Pack Boxes and outlets, as well as the Z-PLUG™ Field Terminated Plug that can be utilized on either end of links coming from the zone enclosure.
Zone cabling supports convergence of data and voice networks, wireless (Wi-Fi) device uplink connections, and a wide range of sensors, control panels, and detectors for lighting, security, and other building communications.
DownloadThis low-profile enclosure accepts up to 24 ports using flat MAX® (copper or fiber) Z-MAX® or TERA® outlets to support a wide range of horizontal copper and fiber applications.
The Passive Ceiling Zone Enclosure is a flexible, economic solution to support zone cabling in a variety of enterprise workspaces. Designed to meet UL 2043 plenum requirements and install flush within a 2×2 ft. drop ceiling tile space the Passive Ceiling Zone Enclosure accepts up to 96 ports.
Available in 24- and 48-ports, the MAX Zone Unit Enclosure is a high-density solution designed for use with low-profile sub-floor applications.
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